An HP runnng hot. Do I, Don't I?
Join Date: Nov 2015
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Complete and utter overkill in terms of researching the problem. The rice size dot is clearly good enough for anything but the most extreme build.
The reason why a blob in the centre of the chip works best is because that is where the majority of the heat is being generated and hardest to dissipate. Around the edges of the chip the heat is all coming one way, out from the centre. The edge is next to cooling air in any case.
The single central blob method minimises the amount of product that needs to be applied, saving costs.
The single blob can be applied quickly and provided the heatsink is applied carefully and with even pressure across the chip, the heatsink compound will spread evenly in a circle, covering the areas where most heat will be generated.
Looking at the tables, there was only a couple of degrees difference between all the methods. Not worthwhile worrying about unless you need the computer to run at midday in the middle of Death Valley.
The reason why a blob in the centre of the chip works best is because that is where the majority of the heat is being generated and hardest to dissipate. Around the edges of the chip the heat is all coming one way, out from the centre. The edge is next to cooling air in any case.
The single central blob method minimises the amount of product that needs to be applied, saving costs.
The single blob can be applied quickly and provided the heatsink is applied carefully and with even pressure across the chip, the heatsink compound will spread evenly in a circle, covering the areas where most heat will be generated.
Looking at the tables, there was only a couple of degrees difference between all the methods. Not worthwhile worrying about unless you need the computer to run at midday in the middle of Death Valley.
